RadiSys(R) Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, today announced the availability of four new Procelerant(TM) COM Express modules all powered by Intel Core 2 Duo Processor technology and the Mobile Intel(R) GS45/GM45 Express chipsets. The new compact 95mm x 125mm computer-on-modules (COMs) are ideal for developers designing portable devices for such applications as medical and machine imaging that mandate processing performance, large file transfers, high-throughput communications, yet low power.
“RadiSys has, once again, enhanced the capabilities of standards-based COMs by offering a family of modules that enables device makers to balance price/performance profiles in current designs with expanding their COM-based solutions into a broad range of new applications,” commented Eric Heikkila, Director of Embedded Hardware and Systems with market research firm VDC. “We’re seeing significant growth in the COM market precisely because of the tremendous flexibility available with this open, standards-based modular form factor.”
Releasing its new COM Express modules simultaneously with Intel’s next-generation Core 2 Duo Processors gives RadiSys customers immediate access to the latest technology thus saving time and resources typically associated with new processor implementations. Three new modules within the expanded Procelerant CEGM45 family offer either the 1.86GHz Intel Core 2 Duo processor SL9400, the 1.2GHz SU9300, or the 1.2GHz Celeron-M 722 processor with a Type 2 pin-out by adding IDE to the module for seamless transition on Type 2 carrier boards. The 2.26GHz Intel Core 2 Duo Processor SP9300 is offered with the Type 3 COM Express pin-out, which provides an additional gigabit Ethernet port in place of the IDE function. All four products complement the 2.53GHz Intel Core 2 Duo T9400-based COM Express module introduced by RadiSys this past July.
With support for up to 8GB DDR3 memory, 6MB cache, and SSE4 SIMD instruction enhancements, the Procelerant CEGM45 family provides the memory capacity and the advanced processing instructions that processor-intensive applications such as medical and machine imaging, test and measurement, and communications platforms need. The on-board MicroSD socket four SATA ports and single or dual Gigabit Ethernet provide increased data storage and transfer for moving or processing large images or data packets. Lower power consumption of Intel’s Core 2 Duo processors extends battery life in portable applications. Additionally, the smaller footprint of the Intel GS45 Express chipset frees board space for integration of more features and greater functionality.
“The expansion of our Procelerant CEGM45 COM Express family reflects our long-standing commitment to deliver to equipment manufacturers solutions that integrate the latest technology as well as total flexibility by adhering to standards-based open platforms,” stated Wade Clowes, Vice President and General Manager of commercial markets for RadiSys. “We have found this to be the best approach to supporting our customers’ current designs and evolving product roadmap.”
About Procelerant COM Express
RadiSys Procelerant(TM) CE blades and boards are designed for embedded applications that require a standard processor and memory subsystem, but also modular flexibility to retain key design level IP on a separate carrier board. Procelerant CE products are based on COM Express(R), a standard that provides a bridge from legacy interfaces such as PCI and IDE to new serial differential signaling technologies such as PCI Express, Serial ATA, USB 2.0, LVDS, and Serial DVO.
Because they are modular and standards-based, RadiSys Procelerant CEGM45 and COM Express products help equipment manufacturers shorten their time to market and reduce development costs. By removing the processor, chipset, and memory from the rest of the design, manufacturers can focus engineering resources on developing differentiating features and avoid the design churn that comes with implementing new processor generations. RadiSys also provides a wide range of COM Expert custom services that further accelerate customer time-to-market by supplying carrier concept definition and design, carrier schematic reviews, BIOS customization, and thermal design.