Symwave, Inc., a leading silicon supplier of system solutions for SuperSpeed USB devices, announced today that its USB 3.0 storage controller has been chosen by the HotChips Symposium Program Committee. The technical paper will be presented by Gideon Intrater, Symwave’s Vice President of Solutions Architecture at the HotChips Symposium 2009 to be held in Palo Alto, California.
HotChips – “A Symposium on High-Performance Chips” is the industry’s premiere venue focused on design innovation and performance advancement techniques. Symwave’s presentation will introduce its USB 3.0 System-on-Chip (SoC) storage controller architecture and the associated engineering challenges in achieving both industry-leading performance and integration. The SoC will be used in both HDD and SSD external storage products and will include a bridge to the SATA interface. The device supports USB 3.0’s data rate of 5Gbps with storage-specific IEEE 1619 and IEEE1667 standards for encryption and authentication as well as legacy USB 2.0 devices. New high-performance external storage products from Symwave’s Tier-1 OEM partners are expected to be available in late 2009.
“We are honored that Gideon’s presentation was selected by HotChips. This recognition by such a prestigious organization is a clear testament to the strength of our team and our engineering execution,” said Yossi Cohen, President and CEO of Symwave. “The momentum around USB 3.0 is growing rapidly and will provide Symwave a great opportunity for our family of high-performance devices leveraging this innovative architecture.”
Symwave’s presentation will take place in the Memorial Auditorium at Stanford University in “Session Two: I/O” on Monday, August 24, at 1:00 PM. Interested parties can register by visiting the HotChips Symposium website at http://www.hotchips.org .
About Gideon Intrater
Mr. Intrater, Symwave’s Vice President of Solutions Architecture brings more than 25 years of experience in the semiconductor market. He is responsible for balancing the company’s marketing and technical objectives, working with customers to define world-leading solutions and ensure robust and differentiated products. Prior to Symwave, he served over 10 years as the VP of Solutions Architecture at MIPS Technologies and he spent 10 years in technical management positions with National Semiconductor Corporation. Mr. Intrater holds over 20 issued patents and brings a keen understanding of the embedded architecture requirements of digital consumer device designs and the challenges associated with deploying that technology.
About Symwave, Inc.
Symwave is a global fabless semiconductor company developing connectivity SoCs (Systems-on-Chip) and software solutions that enable PCs and other consumer electronic devices to realize the benefits of SuperSpeed USB 3.0. The USB 3.0 standard improves device power management, transfers data tenfold faster and maintains backwards compatibility with the billions of USB ports shipped to date. Symwave’s high-performance analog/mixed-signal products leverage the company’s proprietary technology, IP and silicon design capabilities to bring the benefits of uncompromised speed in low-cost standard CMOS processes. The company is privately held with headquarters in Orange County, Calif., and design centers in Shenzhen, China, and San Diego, Calif. Symwave is backed by top-tier venture capital firms including Kodiak Venture Partners and CMEA Ventures and a recent investment by SMSC (NASDAQ:SMSC). Additional information is available at www.symwave.com .